APEC 2022 showcases the latest and greatest power devices that deliver on key power trends, including a new selection of WBG semiconductors.
At the Applied Power Electronics Conference & Exposition (APEC 2022), power device manufacturers focused on giving system power designers more choices to help them select the right component for their application and higher integration to simplify complex power designs. They also delivered a greater selection of wide-bandgap (WBG) semiconductors, highlighting gallium-nitride (GaN) and silicon carbide (SiC) power devices for a range of automotive, communications, and industrial applications.
Other big power trends, in addition to improving efficiency and system complexity, include improved thermal management and smaller packaging. A common theme among these requirements is a need to lower bill of materials (BOM) costs, which is achieved by reducing the number of external components required in these system designs. This also often leads to higher efficiency and simplified designs.
At the same time, there is increasing demand for both SiC and GaN power devices. These devices offer inherent advantages over silicon, including higher bandgaps, lower conduction losses, and faster switching.
Here is a selection of power devices featured at APEC 2022 that deliver higher functionality, integration, and efficiency for a wide range of applications. There is also a sampling of new SiC and GaN devices.
High integration and high efficiency
Eggtronic has expanded its EcoVoltas family of high-efficiency AC/DC architectures with the new SmartEgg zero voltage switching (ZVS) PFC and regulator solution. The SmartEgg solution is designed for power applications in the 75 W to 1 kW range that need both output voltage regulation and power factor correction.
